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About this scholarly article
Volume 12: Mechanics of Solids, Structures and Fluids - Stress Analysis of Hygrothermal Delamination of Quad Flat No-Lead (QFN) Packages by Zhang, Minshu; Lee, S. W. Ricky; Fan, Xuejun is a scholarly article available to read on EtoBox.
- Author
- Zhang, Minshu; Lee, S. W. Ricky; Fan, Xuejun
- Publisher
- ASMEDC
- Published
- 2008
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