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About this Engineering article
Failure mechanism study of anisotropic conductive film (ACF) packages by Mercado, L.L.; White, J.; Sarihan, V.; Lee, T.T. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Mercado, L.L.; White, J.; Sarihan, V.; Lee, T.T.
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 1521-3331)
- Published
- 2003
- Language
- EN
- Field
- Engineering (Physical Sciences)
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