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About this Engineering article
Transient Thermal Stress Analysis of a Plated Through Hole Subjected to Wave Soldering by Barker, D.; Pecht, M.; Dasgupta, A.; Naqvi, S. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Barker, D.; Pecht, M.; Dasgupta, A.; Naqvi, S.
- Publisher
- The American Society of Mechanical Engineers; ASME International ; American Society of Mechanical Engineers (ISSN 1043-7398)
- Published
- 1991
- Language
- EN
- Field
- Engineering (Physical Sciences)
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