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About this Materials Science article
Enhanced pressure-free bonding using mixture of Cu and NiO nanoparticles by Satoh, Toshikazu; Ishizaki, Toshitaka is a Materials Science article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Materials Science.
- Author
- Satoh, Toshikazu; Ishizaki, Toshitaka
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0925-8388)
- Published
- 2015
- Field
- Materials Science (Physical Sciences)