About this scholarly article

Solder Engineering for Optoelectronic Packaging by Y. C. Lee; Nagesh Basavanhally is a scholarly article available to read on EtoBox.

Author

Y. C. Lee; Nagesh Basavanhally

Publisher

The Minerals, Metals & Materials Society; Springer-Verlag; J O M Institute; Metallurgical Society of AIME; Springer Science and Business Media LLC; Society for Mining, Metallurgy and Exploration Inc. (ISSN 1047-4838)

Published

1994