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About this Engineering article
Interconnection and circuit packaging for electromagnetic compatibility : Jerry H. Bogar and Eric Vanderheyden. IEEE Trans. Components Hybrids mfg Technol.CHMT-5 (4), 470 (1982) is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0026-2714)
- Published
- 1983
- Field
- Engineering (Physical Sciences)