About this scholarly article

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. - Experimental and modeling analysis on moisture induced failures in flip chip on flex interconnections with anisotropic conductive film by Yin, C.Y.; Lu, H.; Bailey, C.; Chan, Y.C. is a scholarly article available to read on EtoBox.

Author

Yin, C.Y.; Lu, H.; Bailey, C.; Chan, Y.C.

Publisher

IEEE

Published

2005

Language

EN