About this scholarly article

2010 IEEE CPMT Symposium Japan - Development of high speed Copper CMP slurry for TSV application based on friction analysis by Amanokura, Jin; Ono, Hiroshi; Hombo, Kyoko is a scholarly article available to read on EtoBox.

Author

Amanokura, Jin; Ono, Hiroshi; Hombo, Kyoko

Publisher

IEEE

Published

2010

Language

EN