About this scholarly article

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) - Evaluation of commercially available, thick, photosensitive films as a stress compensation layer for wafer level packaging by Keser, B.; Prack, E.R.; Fang, T. is a scholarly article available to read on EtoBox.

Author

Keser, B.; Prack, E.R.; Fang, T.

Publisher

IEEE

Published

2001

Language

EN