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About this Engineering article
Hot Spots Caused by Voids and Cracks in the Chip Mountdown Medium in Power Semiconductor Packaging by Yerman, A.; Burgess, J.; Carlson, R.; Neugebauer, C. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Yerman, A.; Burgess, J.; Carlson, R.; Neugebauer, C.
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 0148-6411)
- Published
- 1983
- Language
- EN
- Field
- Engineering (Physical Sciences)
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