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About this Materials Science article
Formation of passivation and adhesion layers for Cu via nitridation of Cu-Ti in an ammonia ambient by Daniel Adams; T.L. Alford; S.A. Rafalski; M.J. Rack; S.W. Russell; M.J. Kim; J.W. Mayer is a Materials Science article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Materials Science.
- Author
- Daniel Adams; T.L. Alford; S.A. Rafalski; M.J. Rack; S.W. Russell; M.J. Kim; J.W. Mayer
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0254-0584)
- Published
- 1996
- Field
- Materials Science (Physical Sciences)