Opening book details…
About this Engineering article
Numerical Simulation of Delamination in IC Packages Using a New Variable-Order Singular Boundary Element by Tay, A. A. O.; Lee, K. H.; Lim, K. M. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Tay, A. A. O.; Lee, K. H.; Lim, K. M.
- Publisher
- The American Society of Mechanical Engineers; ASME International ; American Society of Mechanical Engineers (ISSN 1043-7398)
- Published
- 2003
- Language
- EN
- Field
- Engineering (Physical Sciences)