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About this Engineering article
Wetting interactions between the Ni-Cu-P deposit and In-Sn solders by Chun-Jen Chen, ; Kwang-Lung Lin, is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Chun-Jen Chen, ; Kwang-Lung Lin,
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 1070-9894)
- Published
- 1997
- Language
- EN
- Field
- Engineering (Physical Sciences)