About this scholarly article

Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307) - Thermal management of packaged IC by experimentally verified finite element modeling by Pape, H.; Beyfuss, M.; Kutscherauer, R. is a scholarly article available to read on EtoBox.

Author

Pape, H.; Beyfuss, M.; Kutscherauer, R.

Publisher

IEEE

Published

1997