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The Effect of Solder-Joint Temperature Rise on Ceramic-Ball-Grid Array to Board interconnection Reliability: The Motorola PowerPC 603 TM and PowerPC 604 rM Microprocessors and MPC105 Bridge/Memory Controller The Effect of Solder-Joint Temperature Rise on Ceramic-Bali-Grid Array to Board Interconnection Reliability: The Motorola PowerPC 603 TM and PowerPC 604 TM Microprocessors and MPC105… by David, R (author);Gary, Gerke (author);Kromann, B (author) is a scholarly article available to read on EtoBox.

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David, R (author);Gary, Gerke (author);Kromann, B (author)