About this Materials Science article
Material removal mechanism of SiC ceramics by elliptic ultrasonic vibration-assisted grinding (EUVAG) using single grain by Kun Zhang; Zhen Yin; Chenwei Dai; Qing Miao; Peng Zhang; Ziyang Cao is a Materials Science article available to read on EtoBox.
The variation laws of grinding force, grinding specific energy, material removal rate, scratch morphology, and smooth surface ratio are investigated from the perspectives of wheel speed and undeformed chip thickness to study the material removal mechanism of elliptic ultrasonic vibration-assisted grinding (EUVAG) of SiC ceramics. First, the characteristics of undeformed chip thickness are analyzed based on the trajectory of grain in EUVAG. Then, a comparative experiment of EUVAG and conventional grinding (CG) with SiC ceramics of single diamond-grain scratches is conducted. Experimental results show that EUVAG plays a significant role in reducing grinding force and specific energy, which improves the material removal rate compared with CG. The grinding force is proportional to the undeformed chip thickness, and the grinding force ratio (normal force/tangential force) ranges from 3.8 to 9.8 under CG and from 2.2 to 7.1 under EUVAG. With the increase in wheel speed, grinding force increases first, then decreases, and finally increases again. As a whole, the grinding specific energy decreases with the increase in undeformed chip thickness, and it rises with the increase in wheel speed
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- Author
- Kun Zhang; Zhen Yin; Chenwei Dai; Qing Miao; Peng Zhang; Ziyang Cao
- Publisher
- Elsevier BV
- Published
- 2022
- Language
- EN
- Field
- Materials Science (Physical Sciences)