About this scholarly article

Proceedings of Technical Program of 2012 VLSI Design, Automation and Test - Post-bond test techniques for TSVs with crosstalk faults in 3D ICs by Yu-Jen Huang, ; Jin-Fu Li, ; Che-Wei Chou, is a scholarly article available to read on EtoBox.

Author

Yu-Jen Huang, ; Jin-Fu Li, ; Che-Wei Chou,

Publisher

IEEE

Published

2012