Skip to content

Opening book details…

About this Engineering article

Solution Conductivity as a Key Factor for Thin Silica Coating on Colloidal Silver by Nomura, Ken-ichi; Fujii, Shinji; Ohki, Yoshimichi; Awazu, Koichi; Fujimaki, Makoto; Fukuda, Nobuko; Hirakawa, Tsutomu is a Engineering article available to read on EtoBox.

It is typically read by researchers, students, and practitioners in Engineering.

Author
Nomura, Ken-ichi; Fujii, Shinji; Ohki, Yoshimichi; Awazu, Koichi; Fujimaki, Makoto; Fukuda, Nobuko; Hirakawa, Tsutomu
Publisher
Institute of Pure and Applied Physics; Japan Society of Applied Physics; IOP Publishing (ISSN 0021-4922)
Published
2009
Language
EN
Field
Engineering (Physical Sciences)

More by Nomura, Ken-ichi; Fujii, Shinji; Ohki, Yoshimichi; Awazu, Koichi; Fujimaki, Makoto; Fukuda, Nobuko; Hirakawa, Tsutomu

Browse all works by Nomura, Ken-ichi; Fujii, Shinji; Ohki, Yoshimichi; Awazu, Koichi; Fujimaki, Makoto; Fukuda, Nobuko; Hirakawa, Tsutomu