Opening book details…
About this Engineering article
Experimental Study of Compliant Mechanism Considering Thermal Effect by Hou, Wen Feng is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Hou, Wen Feng
- Publisher
- Trans Tech Publications Inc.; Trans Tech Publications, Ltd.; Scitec Publications Ltd. (ISSN 1660-9336)
- Published
- 2014
- Field
- Engineering (Physical Sciences)