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About this Engineering article
Surface assessment after removing III–V layer on III–V/silicon-on-insulator wafer fabricated by plasma activated bonding by Suzuki, Junichi; Hayashi, Yusuke; Kuno, Yuki; Kang, JoonHyun; Amemiya, Tomohiro; Nishiyama, Nobuhiko; Arai, Shigehisa is a Engineering article available to read on EtoBox.
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- Author
- Suzuki, Junichi; Hayashi, Yusuke; Kuno, Yuki; Kang, JoonHyun; Amemiya, Tomohiro; Nishiyama, Nobuhiko; Arai, Shigehisa
- Publisher
- Institute of Pure and Applied Physics; Japan Society of Applied Physics; IOP Publishing (ISSN 0021-4922)
- Published
- 2014
- Field
- Engineering (Physical Sciences)