About this Engineering article
A Note on the Calculation of Thermal Stresses in Electronic Packaging by Finite Element Methods by Lau, J. H. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Lau, J. H.
- Publisher
- The American Society of Mechanical Engineers; ASME International ; American Society of Mechanical Engineers (ISSN 1043-7398)
- Published
- 1989
- Field
- Engineering (Physical Sciences)