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About this Materials Science article
Argon plasma treatment on Cu surface for Cu bonding in 3D integration and their characteristics by Park, Manseok; Baek, Soojung; Kim, Sungdong; Kim, Sarah Eunkyung is a Materials Science article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Materials Science.
- Author
- Park, Manseok; Baek, Soojung; Kim, Sungdong; Kim, Sarah Eunkyung
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0169-4332)
- Published
- 2015
- Field
- Materials Science (Physical Sciences)
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