About this scholarly article

2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) - Thermal measurements on flip-chipped system-on-chip packages with heat spreader integration by Prieto, R.; Colonna, J.P.; Coudrain, P.; Santos, C.; Vivet, P.; Cheramy, S.; Campos, D.; Farcy, A.; Avenas, Y. is a scholarly article available to read on EtoBox.

Author

Prieto, R.; Colonna, J.P.; Coudrain, P.; Santos, C.; Vivet, P.; Cheramy, S.; Campos, D.; Farcy, A.; Avenas, Y.

Publisher

IEEE

Published

2015

Language

EN