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Can I read Thermal Stresses in One-sided Bond Repair: Geometrically Nonlinear Analysis on EtoBox?
Thermal Stresses in One-sided Bond Repair: Geometrically Nonlinear Analysis by C.N. Duong; J. Yu is a Engineering article available to read on EtoBox.
What is Thermal Stresses in One-sided Bond Repair: Geometrically Nonlinear Analysis about?
The problem of thermal stresses in an infinite isotropic plate rigidly bonded with an unsymmetrical, polygon-shaped reinforcement is analyzed within large deflection plate theory, using the equivalent inclusion method [J. Thermal Stresses 26 ( 2003) 457]. For simplicity, the plate assumes to be cooled down uniformly from a stress free temperature. The earlier approach proposed in [J. Thermal Stresses 26 (2003) 457] has been extended in the present paper to include geometric nonlinearity. Extension of the method to address residual thermal stresses associated with curing of the adhesive is also discussed.
Who reads Thermal Stresses in One-sided Bond Repair: Geometrically Nonlinear Analysis?
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- C.N. Duong; J. Yu
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0167-8442)
- Published
- 2003
- Language
- EN
- Field
- Engineering (Physical Sciences)