About this scholarly article

2012 IEEE 62nd Electronic Components and Technology Conference - Process integration and testing of TSV Si interposers for 3D integration applications by Lannon, J.; Hilton, A.; Huffman, A.; Lueck, M.; Vick, E.; Goodwin, S.; Cunningham, G.; Malta, D.; Gregory, C.; Temple, D. is a scholarly article available to read on EtoBox.

Author

Lannon, J.; Hilton, A.; Huffman, A.; Lueck, M.; Vick, E.; Goodwin, S.; Cunningham, G.; Malta, D.; Gregory, C.; Temple, D.

Publisher

IEEE

Published

2012

Language

EN