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About this Engineering article
INVESTIGATION OF SI-AlTiC WAFER BONDING USING SU-8 by WEE, C. T.; LU, Y; YANG, J. P. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- WEE, C. T.; LU, Y; YANG, J. P.
- Publisher
- World Scientific Publishing Company; World Scientific ; Imperial College Press; World Scientific Pub Co Pte Lt (ISSN 1465-8763)
- Published
- 2003
- Field
- Engineering (Physical Sciences)