About this scholarly article

Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) - Packaging assessment of porous ultra low-k materials by Rasco, M.; Mosig, K.; Jamin Ling, ; Elenius, P.; Augur, R. is a scholarly article available to read on EtoBox.

Author

Rasco, M.; Mosig, K.; Jamin Ling, ; Elenius, P.; Augur, R.

Publisher

IEEE

Published

2002