About this scholarly article

2011 International Symposium on Advanced Packaging Materials (APM) - Thermal conductivity and microhardness of MWCNTs/copper nanocomposites by Xu, L. S.; Chen, X. H.; Liu, X. J.; Yu, Y.; Wu, Y. R. is a scholarly article available to read on EtoBox.

Author

Xu, L. S.; Chen, X. H.; Liu, X. J.; Yu, Y.; Wu, Y. R.

Publisher

IEEE

Published

2011