About this scholarly article

2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Study on the volume effect of mechanical behavior of Cu/Sn/Cu microscale solder joints considering crystal anisotropy by Ding, Chao; Liu, Tian-Han; Lei, Chu-Yi; Qin, Wei; Qin, Hong-Bo; Hou, Bin is a scholarly article available to read on EtoBox.

Author

Ding, Chao; Liu, Tian-Han; Lei, Chu-Yi; Qin, Wei; Qin, Hong-Bo; Hou, Bin

Publisher

IEEE

Published

2020