About this scholarly article

2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Study of Raw Materials Effect on the Dielectric Properties of Epoxy Molding Compound for High Voltage Power Devices by Garg, Nitin; Leong, Yee Hun; Tan, David; Tsuji, Takayuki is a scholarly article available to read on EtoBox.

Author

Garg, Nitin; Leong, Yee Hun; Tan, David; Tsuji, Takayuki

Publisher

IEEE

Published

2019