About this scholarly article

SPIE Proceedings [SPIE Microelectronic Manufacturing '99 - Santa Clara, CA (Wednesday 22 September 1999)] Multilevel Interconnect Technology III - Novel metallization scheme using nitrogen passivated Ti liner for AlCu-based metallization by Schmidbauer, Sven; Spinler, Stefan; Lehr, M. U.; Klotzsche, J.; Hahn, J.; Graef, Mart; Patel, Divyesh N. is a scholarly article available to read on EtoBox.

Author

Schmidbauer, Sven; Spinler, Stefan; Lehr, M. U.; Klotzsche, J.; Hahn, J.; Graef, Mart; Patel, Divyesh N.

Publisher

SPIE

Published

1999