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About this Engineering article
Molded hybrid IC packages : Ranjit Biswas, Hazer Curtis III, Philip A. Deane and Thomas F. Marinis. IEEE Trans. Compon. Hybrids mfg Technol.12(4), 514 (1989) is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0026-2714)
- Published
- 1990
- Field
- Engineering (Physical Sciences)