About this document
TSV-RDL Interconnects for High-Frequency Transmission by xzz475507 is a document available to read on EtoBox.
The document presents an analysis of high-frequency transmission characteristics of through-silicon vias (TSVs) and redistributed layers (RDLs) in interconnects used for 3-D integrated circuits, focusing on their performance up to 40 GHz. It discusses the impact of various electrical parameters on transmission loss and signal integrity, revealing that oxide-layer capacitance is crucial at low frequencies, while inductance dominates at high frequencies. The study employs a through-reflect-line (TRL) deembedd
- Author
- xzz475507
- Language
- EN