About this scholarly article

ECS Transactions - Stress Analysis on Ultra Thin Ground Wafers by Teixeira, R. C.; De Munck, K.; De Moor, P.; Baert, K.; Swinnen, B.; Van Hoof, C.; Kuttel, A. is a scholarly article available to read on EtoBox.

Author

Teixeira, R. C.; De Munck, K.; De Moor, P.; Baert, K.; Swinnen, B.; Van Hoof, C.; Kuttel, A.

Publisher

ECS

Published

2007

Language

EN