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About this Engineering article
Study of electroless Sn-coated Cu microparticles and their application as a high temperature thermal interface material by Hu, Tianqi; Chen, Hongtao; Wang, Chunqing; Huang, Mengshi; Zhao, Fufan is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Hu, Tianqi; Chen, Hongtao; Wang, Chunqing; Huang, Mengshi; Zhao, Fufan
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0257-8972)
- Published
- 2017
- Language
- EN
- Field
- Engineering (Physical Sciences)
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