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About this Decision Sciences article

Thermal Stress and Strain in Microelectronics Packaging, John H. Lau (Editor), Van Nostrand Reinhold, 1993. Number of pages: 883 by P. D. T. O'Connor is a Decision Sciences article available to read on EtoBox.

It is typically read by researchers, students, and practitioners in Decision Sciences.

Author
P. D. T. O'Connor
Publisher
John Wiley and Sons; Wiley (John Wiley & Sons); John Wiley & Sons Inc.; Wiley; FASEB (ISSN 0748-8017)
Published
1997
Language
EN
Field
Decision Sciences (Social Sciences)

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