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About this Engineering article
Investigation of the Trace Line Failure Mechanism and Design of Flexible Wafer Level Packaging by Ming-Chih Yew; Yuan, C.C.A.; Chung-Jung Wu; Dyi-Chung Hu; Wen-Kun Yang; Kuo-Ning Chiang is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Ming-Chih Yew; Yuan, C.C.A.; Chung-Jung Wu; Dyi-Chung Hu; Wen-Kun Yang; Kuo-Ning Chiang
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 1521-3323)
- Published
- 2009
- Field
- Engineering (Physical Sciences)