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Can I read L-type Heat Pipes Application in Electronic Cooling System on EtoBox?
L-type Heat Pipes Application in Electronic Cooling System by Jung-Chang Wang is a Engineering article available to read on EtoBox.
What is L-type Heat Pipes Application in Electronic Cooling System about?
This paper describes the design, modeling, and test of a heat sink with embedded L-shaped heat pipes and plate fins. This type of heat sink is particularly well suited for cooling electronic components such as microprocessors using forced convection. The mathematical model includes all major components from the thermal interface through the heat pipes and fins. It is augmented with measured values for the heat pipe thermal resistance. A Windows-based computer program uses an iterative superposition method to predict the thermal performance. Thermal performance testing shows that a representative heat sink with six heat pipes will carry 160 W and has reached a minimum thermal resistance of 0.22 C/W. The computer software predicted a thermal resistance of 0.21 C/W, which was within 5% of the measured value. The result of this work is a useful thermal management device along with a validated computeraided tool to facilitate rapid design.
Who reads L-type Heat Pipes Application in Electronic Cooling System?
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Jung-Chang Wang
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 1290-0729)
- Published
- 2011
- Language
- EN
- Field
- Engineering (Physical Sciences)