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About this Engineering article
Cooling Rate and Microstructural Investigation of Rapidly Solidified Spherical Mono-Sized Copper Particles by Hu, Ying Yan; Wang, Jun Feng; Li, Can; Gao, Yi Ying; Li, Jian Qiang is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Hu, Ying Yan; Wang, Jun Feng; Li, Can; Gao, Yi Ying; Li, Jian Qiang
- Publisher
- Trans Tech Publications, Ltd.; Trans Tech Publications Ltd. (ISSN 1662-9752)
- Published
- 2020
- Field
- Engineering (Physical Sciences)