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Understanding and Optimizing Oxygen Plasma Treatment For Enhanced Cu-Cu Bonding Application by juhaina ibrahim is a document available to read on EtoBox.
What is Understanding and Optimizing Oxygen Plasma Treatment For Enhanced Cu-Cu Bonding Application about?
This study focuses on optimizing oxygen plasma treatment conditions to enhance copper-copper (Cu-Cu) bonding, aiming to minimize oxidation while maximizing surface energy. The optimal conditions identified were an O2 flow rate of 50 sccm, plasma power of 50 W, and a treatment time of 20 seconds, resulting in a 40% increase in shear strength of the bonds. The findings suggest that controlled O2 plasma treatment effectively improves bonding strength, which is crucial for advanced packaging technologies and hy
- Author
- juhaina ibrahim
- Language
- EN