About this scholarly article

SPIE Proceedings [SPIE Microlithography 2005 - San Jose, CA (Sunday 27 February 2005)] Advances in Resist Technology and Processing XXII - The effect of film thickness on the dissolution rate and hydrogen bonding behavior of photoresist polymer thin films by Singh, Lovejeet; Sturtevant, John L.; Ludovice, Peter J.; Henderson, Clifford L. is a scholarly article available to read on EtoBox.

Author

Singh, Lovejeet; Sturtevant, John L.; Ludovice, Peter J.; Henderson, Clifford L.

Publisher

SPIE

Published

2005

Language

EN