Can I read Proceedings of the 13th International Conference on Mechanical Engineering (ICME2019) on EtoBox?

Proceedings of the 13th International Conference on Mechanical Engineering (ICME2019) by Motalab, Mohammad Abdul (author);Ahmed, Md. Tusher (author);Bappy, Md. Omarsany (author) is a Physics and Astronomy article available to read on EtoBox.

What is Proceedings of the 13th International Conference on Mechanical Engineering (ICME2019) about?

Lead free solder materials have replaced lead based solder materials nowadays for increased environmental concern. Further miniaturization of electronic solder joints in packages has caused electromigration to dominate among all the reliability issues found in electronic packages. This current investigation deals with the effects of mechanical property degradations of SAC (SnAgCu) solder materials of different Ag percentages due to thermal aging on electromigration oriented failure of small scale flip chip solder bumps. Thermal aging causes degradation of strength as well as elastic modulus of the SAC solder material. This degradation in stress-strain behavior plays an utterly important role in electromigration oriented mass diffusion and subsequent failure in the solder joints. This research highlights the linkage between thermal aging oriented strength degradation and its effect on electromigration oriented void propagation rate and time to failure. Structural-electric-diffusion analyses with commercial finite element analysis software have been performed for different aging conditions (1 to 20 days of aging at 100 o C) at different electromigration temperatures. Percentage of Ag

Who reads Proceedings of the 13th International Conference on Mechanical Engineering (ICME2019)?

Author

Motalab, Mohammad Abdul (author);Ahmed, Md. Tusher (author);Bappy, Md. Omarsany (author)

Publisher

AIP Publishing

Published

2021

Language

EN

Field

Physics and Astronomy (Physical Sciences)