About this Engineering article
Cu(TiWNx) Film as a Barrierless Buffer Layer for Metallization Applications by Lin, Chon-Hsin; Chuang, Hsin-Yi; Kao, C. Robert is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Lin, Chon-Hsin; Chuang, Hsin-Yi; Kao, C. Robert
- Publisher
- Institute of Pure and Applied Physics; Japan Society of Applied Physics; IOP Publishing (ISSN 0021-4922)
- Published
- 2013
- Field
- Engineering (Physical Sciences)