About this scholarly article

2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Creep fracture analysis and control measures of aerospace electronic products by Zhang, Binbin; He, Zongpeng; Zhang, Zhenming; Zhang, Jun; Wang, Ningning; Fei, Jingming is a scholarly article available to read on EtoBox.

Author

Zhang, Binbin; He, Zongpeng; Zhang, Zhenming; Zhang, Jun; Wang, Ningning; Fei, Jingming

Publisher

IEEE

Published

2017

Language

EN