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About this Engineering article
The Application of Commitment Utilization Factor (CUF) to Thermal Unit Commitment by Lee, F.N. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Lee, F.N.
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 0272-1724)
- Published
- 1991
- Field
- Engineering (Physical Sciences)