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About this Engineering article
Materials for Thermal Conduction by D.D.L Chung is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- D.D.L Chung
- Publisher
- Elsevier Science; Elsevier ; Elsevier Ltd.; Elsevier BV (ISSN 1359-4311)
- Published
- 2001
- Language
- EN
- Field
- Engineering (Physical Sciences)