About this scholarly article

2020 21st International Conference on Electronic Packaging Technology (ICEPT) - A Study of the Global and Local Cu Protrusion in Cu-Filled Through Silicon Vias Under Heat Treatment by Zhao, Xuewei; Li, Nannan; Xing, Chaoyang; yang, Jianqun is a scholarly article available to read on EtoBox.

Author

Zhao, Xuewei; Li, Nannan; Xing, Chaoyang; yang, Jianqun

Publisher

IEEE

Published

2020