About this scholarly article

2011 IEEE International Interconnect Technology Conference - CPI assessment using a novel characterization technique based on bump-assisted scratch-indentation testing by Geisler, Holm; Lehr, Matthias U.; Platz, Alexander; Kuchenmeister, Frank; Mayer, Ulrich; Rossler, Thomas; Paul, Jens; Lehmann, Lothar; Hofmann, Petra; Engelmann, Hans-Jurgen is a scholarly article available to read on EtoBox.

Author

Geisler, Holm; Lehr, Matthias U.; Platz, Alexander; Kuchenmeister, Frank; Mayer, Ulrich; Rossler, Thomas; Paul, Jens; Lehmann, Lothar; Hofmann, Petra; Engelmann, Hans-Jurgen

Publisher

IEEE

Published

2011

Language

EN