About this scholarly article

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Electrical design of high density low cost package for a switch ASIC by Jun Li, ; Liqiang Cao, ; Shuhua Liu, ; Jing Zhou, ; Qidong Wang, ; Guidotti, Daniel; Lixi Wan, ; Cheng Liao, is a scholarly article available to read on EtoBox.

Author

Jun Li, ; Liqiang Cao, ; Shuhua Liu, ; Jing Zhou, ; Qidong Wang, ; Guidotti, Daniel; Lixi Wan, ; Cheng Liao,

Publisher

IEEE

Published

2010

Language

EN