About this scholarly article

2012 35th International Spring Seminar on Electronics Technology - Modelling and testing the impact of hot solder dip process on leaded components by Stoyanov, Stoyan; Best, Chris; Alam, M. O.; Bailey, Chris; Tollafield, Peter; Parker, Mike; Scott, Jim is a scholarly article available to read on EtoBox.

Author

Stoyanov, Stoyan; Best, Chris; Alam, M. O.; Bailey, Chris; Tollafield, Peter; Parker, Mike; Scott, Jim

Publisher

IEEE

Published

2012

Language

EN